Housing structure for handheld electronic device

ABSTRACT

A tablet computing system may include a housing member defining a first portion of a back exterior surface of the tablet computer, at least a portion of a side exterior surface of the tablet computer, a raised rim extending from the back exterior surface and at least partially defining a sensor assembly hole extending through the housing member, and a support ledge positioned in the sensor assembly hole. The tablet computing system may also include a frame member positioned at least partially in the sensor assembly hole and coupled to the support ledge, a camera bracket coupled to the frame member, a first camera module coupled to the camera bracket, aa second camera module coupled to the camera bracket, the camera bracket fixing the relative positions of the first camera module and the second camera module, and a cover member positioned in the sensor assembly hole and attached to the frame member.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a nonprovisional patent application of and claimsthe benefit of U.S. Provisional Patent Application No. 62/986,588, filedMar. 6, 2020 and titled “Housing Structure for Handheld ElectronicDevice,” the disclosure of which is hereby incorporated herein byreference in its entirety.

FIELD

The subject matter of this disclosure relates generally to electronicdevices, and more particularly, to housing structures for handheldelectronic devices.

BACKGROUND

Modern consumer electronic devices take many shapes and forms, and havenumerous uses and functions. Tablet computing systems, for example, mayinclude touch-sensitive displays, speakers, cameras, microphones,batteries, as well as sophisticated processors and other electronics.These and other subsystems may be integrated into compact, handheldproducts that provide myriad functions while being reliable and capableof withstanding daily use.

SUMMARY

A tablet computing system may include a housing member defining a firstportion of a back exterior surface of the tablet computer, at least aportion of a side exterior surface of the tablet computer, a raised rimextending from the back exterior surface and at least partially defininga sensor assembly hole extending through the housing member, and asupport ledge positioned in the sensor assembly hole. The tabletcomputing system may also include a frame member positioned at leastpartially in the sensor assembly hole and coupled to the support ledge,a camera bracket coupled to the frame member, a first camera modulecoupled to the camera bracket, aa second camera module coupled to thecamera bracket, the camera bracket fixing the relative positions of thefirst camera module and the second camera module, and a cover memberpositioned in the sensor assembly hole and attached to the frame member.An exterior surface of the cover member may define a second portion ofthe back exterior surface of the tablet computing system.

The raised rim may define a planar top surface and the exterior surfaceof the cover member may be flush with or recessed relative to the planartop surface of the raised rim. The frame member may define a network ofribs configured to transfer impact force from a first portion of thehousing member to a second portion of the housing member. The framemember may be fusion bonded to the housing member.

The cover member may define a first hole aligned with the first cameramodule and a second hole aligned with the second camera module. Thetablet computing system further include a first transparent camerawindow positioned in the first hole and covering the first cameramodule, and a second transparent camera window positioned in the secondhole and covering the second camera module.

The frame member may define a first datum surface and a second datumsurface, and the tablet computing system may further include a firstspring configured to apply a first force to the camera bracket in afirst direction, thereby forcing the camera bracket against the firstdatum surface, and a second spring configured to apply a second force tothe camera bracket in a second direction different from the firstdirection, thereby forcing the camera bracket against the second datumsurface.

The tablet computing system may include a depth sensor coupled to thecamera bracket and configured to determine a distance between the tabletcomputing system and an external object. The cover member may define anoptically transmissive window region positioned over the depth sensorand an opaque region at least partially surrounding the opticallytransmissive window region.

A tablet computing system may include a housing member defining at leasta portion of a back exterior surface of the tablet computing system anda raised rim extending from the back exterior surface and at leastpartially defining a sensor assembly hole extending through the housingmember. The tablet computing system may also include a frame memberpositioned at least partially in the sensor assembly hole and coupled tothe housing member, the frame member defining a first recess in a frontside of the frame member, a second recess in a rear side of the framemember, and a first hole extending through the frame member from thefirst recess to the second recess. The tablet computing system may alsoinclude a cover member positioned in the sensor assembly hole andattached to the frame member, the cover member defining a second holeextending through the cover member. The tablet computing system may alsoinclude a microphone module positioned in the second recess of the framemember and configured to receive sound via an acoustic path extendingthrough the first hole in the frame member, a volume defined between thefirst recess and the cover member, and the second hole in the covermember. The first hole and the second hole may be not coaxial. Thetablet computing system may further include a microphone screen coupledto the cover member and covering the second hole.

The cover member may be attached to the frame member with an adhesive,and the adhesive may surround the first recess and define a hermeticseal between the frame member and the cover member around the firstrecess. The adhesive may be a first adhesive, the microphone module maybe attached to the frame member with a second adhesive, and the secondadhesive may define a hermetic seal between the frame member and themicrophone module. The first and second adhesives may hermetically sealthe acoustic path from an internal volume of the tablet computingsystem. The tablet computing system may further include a microphonescreen coupled to the cover member and covering the second hole.

The cover member may define a third hole extending through the covermember, and the tablet computing system may further include a flashmodule coupled to the frame member and a flash window positioned in thethird hole and covering the flash module.

An electronic device may include a housing member defining a firstportion of a back exterior surface of the electronic device and a raisedrim extending from the back exterior surface and at least partiallydefining a sensor assembly hole extending through the housing member.The electronic device may further include a frame member positioned atleast partially in the sensor assembly hole and coupled to the housingmember, a camera bracket coupled to the frame member, a first cameramodule coupled to the camera bracket and comprising a camera lens havinga first focal length, a second camera module coupled to the camerabracket and comprising a camera lens having a second focal lengthdifferent from the first focal length, and a depth sensor module coupledto the camera bracket. The depth sensor module may include an opticalemitter and an optical sensor configured to detect light emitted by theoptical emitter and reflected by an object external to the electronicdevice. The electronic device may further include a cover memberpositioned in the sensor assembly hole and defining a second portion ofthe back exterior surface of the electronic device. The electronicdevice may further include a microphone module coupled to the framemember and a flash module coupled to the frame member. The frame membermay be welded to the housing member, and the frame member may define anetwork of ribs configured to transfer impact force from a first portionof the housing member to a second portion of the housing member.

The frame member defines a depth sensor hole configured to receive atleast a portion of the depth sensor module, and the electronic devicemay further include a conductive cowling at least partially surroundingthe depth sensor hole and defining a plurality of conductive tabsextending into the depth sensor hole and a compliant material configuredto bias the plurality of conductive tabs against the depth sensormodule.

The frame member may be conductively coupled to a ground plane of theelectronic device, and the depth sensor module may be conductivelycoupled to the frame member via the conductive cowling. The conductivecowling may include a metal foil.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure will be readily understood by the following detaileddescription in conjunction with the accompanying drawings, wherein likereference numerals designate like structural elements, and in which:

FIGS. 1A-1B depict an example electronic device;

FIG. 2A depicts an exploded view of an example electronic device;

FIG. 2B depicts a partial cross-sectional view of a portion of anexample electronic device;

FIG. 3A depicts a portion of an example electronic device;

FIG. 3B depicts the electronic device of FIG. 3A impacting a surface;

FIG. 3C depicts a portion of the electronic device of FIG. 3A;

FIGS. 3D-3E depict partial cross-sectional views of the electronicdevice of FIG. 3A;

FIG. 3F depicts a partial cross-sectional view of another exampleelectronic device;

FIG. 4A depicts a component of an example electronic device;

FIG. 4B depicts an exploded view of an example electronic device;

FIG. 4C depicts a portion of the electronic device of FIG. 4B;

FIGS. 5A-5C depict partial cross-sectional views of an exampleelectronic device;

FIG. 6A depicts a portion of an example electronic device;

FIGS. 6B-6C depict partial cross-sectional views of the electronicdevice of FIG. 6A;

FIG. 6D depicts a component of an electronic device;

FIG. 7A depicts a portion of an example electronic device;

FIG. 7B depicts a detail view of the electronic device of FIG. 7A;

FIG. 7C depicts a partial cross-sectional view of the electronic deviceof FIG. 7A;

FIG. 8A depicts an example sensor component for an electronic device;

FIGS. 8B-8D depict partial cross-sectional views of a sensor componentfor an electronic device; and

FIG. 9 depicts a schematic diagram of an example electronic device.

DETAILED DESCRIPTION

Reference will now be made in detail to representative embodimentsillustrated in the accompanying drawings. It should be understood thatthe following descriptions are not intended to limit the embodiments toone preferred embodiment. To the contrary, it is intended to coveralternatives, modifications, and equivalents as can be included withinthe spirit and scope of the described embodiments as defined by theappended claims.

Modern portable electronic devices are complex devices that include manycomplex, sophisticated components and systems that facilitate amultitude of functions. For example, tablet computers according to theinstant disclosure may include touch- and/or force-sensitive displays,numerous cameras (including both front- and rear-facing cameras), GPSsystems, haptic actuators, wireless charging systems, and all requisitecomputing components and software to operate these (and other) systemsand otherwise provide the functionality of the tablet computers. Tomaintain the portability and usability of such devices, these systemsmust be physically integrated into small, thin, and lightweight devices,while also ensuring that the devices remain robust and capable ofeveryday use.

FIG. 1A shows an example electronic device 100 embodied as a tabletcomputing system, also referred to as a tablet computer. While thedevice 100 is a tablet computer, the concepts presented herein may applyto any appropriate electronic devices, including wearable devices (e.g.,watches), laptop computers, handheld gaming devices, mobile phones,computing peripherals (e.g., mice, touchpads, keyboards), or any otherdevice. Accordingly, any reference to an “electronic device” encompassesany and all of the foregoing.

The electronic device 100 includes a cover 102 (e.g., a front cover),such as a glass, glass-ceramic, ceramic, plastic, sapphire, or othersubstantially transparent material, component, or assembly, attached toa housing 104. The cover 102 may be positioned over a display 103. Thecover 102 may be formed from glass (e.g., a chemically strengthenedglass), sapphire, ceramic, glass-ceramic, plastic, or another suitablematerial. The cover 102 may be formed as a monolithic or unitary sheet.The cover 102 may also be formed as a composite of multiple layers ofdifferent materials, coatings, and other elements.

The display 103 may be at least partially positioned within the internalvolume of the housing 104. The display 103 may be coupled to the cover102, such as via an adhesive or other coupling scheme. The display 103may include a liquid-crystal display (LCD), light-emitting diode,organic light-emitting diode (OLED) display, an active layer organiclight emitting diode (AMOLED) display, organic electroluminescent (EL)display, electrophoretic ink display, or the like. The display 103 maybe configured to display graphical outputs, such as graphical userinterfaces, that the user may view and interact with. The device 100 mayalso include an ambient light sensor that can determine properties ofthe ambient light conditions surrounding the device 100. The device 100may use information from the ambient light sensor to change, modify,adjust, or otherwise control the display 103 (e.g., by changing a hue,brightness, saturation, or other optical aspect of the display based oninformation from the ambient light sensor).

The display 103 may include or be associated with one or more touch-and/or force-sensing systems. In some cases, components of the touch-and/or force-sensing systems are integrated with the display stack. Forexample, electrode layers of a touch- and/or force-sensor may beprovided in a stack that includes display components (and is optionallyattached to or at least viewable through the cover 102). The touch-and/or force-sensing systems may use any suitable type of sensingtechnology, including capacitive sensors, resistive sensors, surfaceacoustic wave sensors, piezoelectric sensors, strain gauges, or thelike. The outer or exterior surface of the cover 102 may define an inputsurface (e.g., a touch- and/or force-sensitive input surface) of thedevice. While both touch- and force-sensing systems may be included, insome cases the device 100 includes a touch-sensing system and does notinclude a force-sensing system. The device 100, using the touch- and/orforce-sensing systems may be configured to detect inputs applied to thecover 102. Such inputs include, for example, touch inputs applied by oneor more fingers, a stylus, or another implement. Touch-based inputsapplied using fingers, styli, or other implements may include touches,taps, single- or multi-finger gestures (e.g., swipes, pinching gestures,etc.), handwriting inputs, drawing inputs, or the like. In some cases,force sensing systems detect an amount of force associated with atouch-based input. The device 100 may take different actions based onthe amount of force detected. For example, if a touch-based input(applied to a selectable element displayed on the display 103, forexample) is associated with a force that is below a threshold, thedevice 100 may take a first action (e.g., launch an applicationassociated with the selectable element), and if the touch-based input isassociated with a force that exceeds the threshold, the device 100 maytake a second action (e.g., display a menu associated with theselectable element). Other actions are also contemplated.

The device 100 may also include a front-facing camera 111. Thefront-facing camera 111 may be positioned below or otherwise coveredand/or protected by the cover 102. The front-facing camera 111 may haveany suitable operational parameters. For example, the front-facingcamera 111 may include a 12 megapixel sensor (with 1 micron pixel size),and an 80-90° field of view. The front-facing camera 111 may have fixedfocus optical elements with an aperture number of f/1.8. Other types ofcameras may also be used for the front-facing camera 111.

The device 100 may also include one or more buttons (e.g., buttons 106,108), switches, and/or other physical input systems. Such input systemsmay be used to control power states (e.g., the button 106), changespeaker volume (e.g., buttons 108), switch between “ring” and “silent”modes, and the like.

The device 100 may also include a charging port 113 (e.g., for receivinga power cable for providing power to the device 100 and charging thebattery of the device 100). The device 100 may also include one or morespeakers and one or more microphones. The housing 104 may include audioopenings to allow sound (produced by internal speakers) to exit thehousing 104 and to allow an internal microphone to be acousticallycoupled to the surrounding environment through an audio opening.

The housing 104 may be a multi-piece housing. For example, the housing104 may be formed from multiple housing members 128, 130, which arestructurally coupled together via one or more joint structures 112. Thejoint structure 112 may be mechanically interlocked with the housingmembers 128, 130 to structurally couple the housing members and form astructural housing assembly. Together, the housing members 128 and 130and the joint structure 112 may define four sidewalls (and thus fourexterior side surfaces) of the device 100. Thus, both the housingmembers and the joint structures define portions of the exterior sidesurfaces of the device 100. For example, the housing member 128 maydefine a first side surface the electronic device, and portions ofsecond and third side surfaces of the electronic device. The housingmember 130 may also define portions of the second and third sidesurfaces of the electronic device, and a fourth side surface. Thehousing member 130 may also define substantially all of the backexterior surface of the device 100. The housing member 130 may be aunitary structure, such as a single piece of metal (or other suitablematerial), that defines portions of the back surface and two, three, orfour side surfaces. (In some cases, the housing member 130 may beconfigured to only define a back surface of the device 100.)

The housing members 128 and 130 may be formed of a conductive material(e.g., a metal such as aluminum, stainless steel, or the like), and thejoint structure 112 may be formed of one or more polymer materials(e.g., glass-reinforced polymer). The joint structure 112 may includeone or more molded elements. The joint structure 112 may be formed of apolymer material (e.g., a fiber-reinforced polymer). In the case wherethe joint structure 112 is formed of two or more molded elements, themolded elements may be formed of different materials. For example, aninner molded element may be formed of a first material (e.g., a polymermaterial), and an outer molded element may be formed of a secondmaterial that is different from the first (e.g., a different polymermaterial). The materials may have different properties, which may beselected based on the different functions of the inner and outer moldedelements. For example, the inner molded element may be configured tomake the main structural connection between housing members, and mayhave a higher mechanical strength and/or toughness than the outer moldedelement. On the other hand, the outer molded element may be configuredto have a particular appearance, surface finish, chemical resistance,water-sealing function, or the like, and its composition may be selectedto prioritize those functions over mechanical strength).

In some cases, one or more of the housing members 128, 130 (or portionsthereof) are configured to operate as antennas (e.g., members that areconfigured to transmit and/or receive electromagnetic waves tofacilitate wireless communications with other computers and/or devices).To facilitate the use of the housing members as antennas, feed andground lines may be conductively coupled to the housing members tocouple the housing members to other antenna and/or communicationcircuitry. Further, the joint structure 112 may be substantiallynon-conductive to provide suitable separation and/or electricalisolation between the housing members. The joint structure 112 may beused to tune the radiating portions, reduce capacitive coupling betweenradiating portions and other structures, and the like. In addition tothe housing members 128, 130, some or all of which may be used asantennas, the device 100 may also include various internal antennaelements that are configure to transmit and receive wirelesscommunication signals through various regions of the housing 104.

The exterior surfaces of the housing members 128, 130 may havesubstantially a same color, surface texture, and overall appearance asthe exterior surfaces of the joint structure 112. In some cases, theexterior surfaces of the housing members 128, 130 and the exteriorsurfaces of the joint structure 112 are subjected to at least one commonfinishing procedure, such as abrasive-blasting, machining, polishing,grinding, or the like. Accordingly, the exterior surfaces of the housingmembers and the joint structures may have a same or similar surfacefinish (e.g., surface texture, roughness, pattern, etc.). In some cases,the exterior surfaces of the housing members and the joint structuresmay be subjected to a two-stage blasting process to produce the targetsurface finish.

The device 100 may also include a sensor 110. The sensor 110 may beconfigured to detect a presence or configuration of an accessory. Forexample, a foldable cover accessory may be provided for use with thedevice 100. The sensor 110 may be configured to detect whether the coveraccessory is in an open configuration (e.g., so the cover 102 isexposed, graphical outputs on the display 103 are visible, and the usermay provide touch-based inputs on the cover 102). The device 100 maytake different actions in response to detecting whether the coveraccessory is open or closed, and/or based on detecting a transition(e.g., when the cover accessory transitions from opened to closed, orvice versa). For example, the device 100 may activate the display 103upon detecting that the cover accessory has been opened, and deactivatethe display 103 upon detecting that the cover accessory has been closed.

The sensor 110 may be configured to detect a component or material ofthe accessory cover. For example, the sensor 110 may be a Hall effectsensor, an optical sensor, a reed switch, a magnetometer, an inductivesensor, or any other suitable sensor or sensor system. In some cases,the sensor 110 (e.g., a Hall effect sensor) may detect the presence of amagnet in the cover accessory, where the magnet is positioned so that itis proximate the sensor 110 when the cover accessory is in a closedconfiguration. The sensor 110 may be positioned below (or behind) thedisplay 103, and may sense the presence of the cover accessory throughthe cover 102, the display 103, components of the touch- and/orforce-sensing systems, or the like.

FIG. 1B illustrates a back side of the device 100. The housing members128, 130 and the joint structure 112 may each define part of a backsurface 114 of the device 100. The device 100 may also include arear-facing sensor region 116. The rear-facing sensor region 116 mayinclude a cover member 132, which may be set into an opening in thehousing member 130. The housing member 130 may define a raised rim 134that surrounds the outer perimeter of the cover member 132. The covermember 132 may overlie various types of input and output devices,including but not limited to one or more cameras, a flash, a microphone,a depth- or distance-sensing device, an ambient-light sensor, or thelike. The cover member 132 may define openings in which other componentsmay be positioned (e.g., meshes, windows, or the like), sensor windows(e.g., areas that are transparent to visible light, infrared light, orthe like), or the like.

The device 100 may include, in or otherwise associated with therear-facing sensor region 116, a first camera 118, a second camera 120,and a flash 122. The first camera 118 may be a super-wide angle camerahaving a 12 megapixel sensor and a camera lens with a first focal length(or range of focal lengths), a wide field of view (e.g., 120° FOV)optical stack with an aperture number of f/2.4, and the second camera120 may be a wide angle camera having a 12 megapixel sensor, a secondfocal length (or range of focal lengths) different from the first focallength, and an aperture number of f/1.6. In some cases, the first andsecond cameras may have other optical properties and/or performance. Forexample, the first or the second camera may be a telephoto camera havinga 12 megapixel sensor with a 2× optical zoom optical stack and having anaperture number ranging from f/2.0 to f/2.2. One or more of the cameras118, 120 may also include optical image stabilization, whereby thecamera lens is dynamically moved relative to a fixed structure withinthe device 100 to reduce the effects of “camera shake” on imagescaptured by the camera. The camera may also perform optical imagestabilization by moving the image sensor relative to a fixed lens oroptical assembly.

The cameras 118, 120, along with associated processors and software, mayprovide several image-capture features. For example, the cameras 118,120 may be configured to capture full-resolution video clips of acertain duration each time a user captures a still image. As usedherein, capturing full-resolution images (e.g., video images or stillimages) may refer to capturing images using all or substantially all ofthe pixels of an image sensor, or otherwise capturing images using themaximum resolution of the camera (regardless of whether the maximumresolution is limited by the hardware or software).

The captured video clips may be associated with the still image. In somecases, users may be able to select individual frames from the video clipas the representative still image associated with the video clip. Inthis way, when the user takes a snapshot of a scene, the camera willactually record a short video clip (e.g., 1 second, 2 seconds, or thelike), and the user can select the exact frame from the video to use asthe captured still image (in addition to simply viewing the video clipas a video).

The cameras 118, 120 may also include one or more cameras having ahigh-dynamic-range (HDR) mode, in which the camera captures imageshaving a dynamic range of luminosity that is greater than what iscaptured when the camera is not in the HDR mode. In some cases, thecameras 118, 120 automatically determine whether to capture images in anHDR or non-HDR mode. Such determination may be based on various factors,such as the ambient light of the scene, detected ranges of luminosity,tone, or other optical parameters in the scene, or the like. HDR imagesmay be produced by capturing multiple images, each using differentexposure or other image-capture parameters, and producing a compositeimage from the multiple captured images.

The cameras 118, 120 may also include or be configured to operateaccording to an object detection mode, in which a user can select(and/or the device 100 can automatically identify) objects within ascene to facilitate those objects being processed, displayed, orcaptured differently than other parts of the scene. For example, a usermay select (or the device 100 may automatically identify) a person'sface in a scene, and the device 100 may focus on the person's face whileselectively blurring the portions of the scene other than the person'sface. Notably, features such as the HDR mode and the object detectionmode may be provided with a single camera (e.g., a single lens andsensor).

The flash 122 is configured to illuminate a scene to facilitatecapturing images with the cameras 118, 120. The flash 122 may includeone or more light sources, such as one or more light emitting diodes(e.g., 1, 2, 3, 4, or more LEDs). The flash 122, in conjunction with thecameras 118, 120 or other systems of the device 100, may adjust thecolor temperature of the light emitted by the light sources in order tomatch or otherwise adapt to a color temperature within a scene beingcaptured. The device 100 may also be configured to operate the flash 122and the shutters of the cameras 118, 120 to avoid consequences of flash“flicker.” For example, the device 100 may avoid capturing exposuresduring moments where the flash 122 is at a period of no or lowillumination (e.g., which may be caused by discontinuous or pulsedoperation of the LEDs).

The device 100 may also include, in or otherwise associated with therear-facing sensor region 116, a microphone 124 and a depth sensor 126.The microphone 124 may be configured to capture audio, and may beassociated with an opening in the cover member 132. The microphone 124and its physical integration in the device 100 are described herein withrespect to FIGS. 7A-7C. The depth sensor 126 may be configured toestimate a distance between the device 100 and a separate object ortarget. The depth sensor 126 may include an emitter and a receiver, andmay configured to emit and receive light through the material of thecover member 132. The depth sensor 126 and its physical integration inthe device 100 are described herein with respect to FIGS. 6A-6D.

FIG. 2A depicts an exploded view of a portion of the electronic device100. In particular, FIG. 2A depicts an exploded view of a portion of thedevice 100 that includes the rear-facing sensor region 116 (alsoreferred to herein simply as the sensor region 116). The housing member130 may define a raised rim 134, and the raised rim 134, in turn,defines a sensor assembly hole 200 (or simply hole 200) that extendsthrough the housing member 130. The hole 200 may accommodate componentsof the sensor region 116, such as the cameras 118, 120, the flash 122,the microphone 124, and the depth sensor 126. For example, the hole 200may provide internal components with optical, audio, or other access tothe environment surrounding the device 100 (e.g., so that cameras cancapture images, a flash can illuminate scenes, a microphone can receiveaudio, etc.). In some cases, more, fewer, or different components may beaccommodated within or proximate the hole 200.

FIG. 2A illustrates first and second camera modules 202, 204, which mayinclude the camera lenses and sensors of the first and second cameras118, 120, respectively. FIG. 2A also illustrates a depth sensor module206, which may include one or more sensors, emitters, and lenses of thedepth sensor 126. For example, the depth sensor module 206 may includeone or more optical emitters 212 that are adapted to emit one or morebeams of light, which may be used to estimate the distance. In somecases, the one or more beams of light are coherent light beams having asubstantially uniform wavelength/frequency. A coherent light source mayfacilitate depth measurements using a time of flight, phase shift, orother optical effect. The depth sensor module 206 may also include anoptical sensor 214 (as well as associated lenses) that usestime-of-flight or another optical effect to measure a distance betweenthe device 100 and an external object. For example, the optical sensor214 may detect the reflected light emitted from the optical emitter 212.In some cases, the depth sensor module 206 uses a sonic output, radiooutput, or other type of output that may be used to measure the distancebetween the device 100 and one or more external objects.

FIG. 2A also illustrates a flash module 208 and a microphone module 210.As described herein, the flash module 208 may include one or more lightsources and be configured to illuminate a scene to facilitate capturingimages with the cameras. The microphone module 210 may include adiaphragm, membrane, or other transducer component(s) for detectingsound. The camera modules 202, 204, the depth sensor module 206, themicrophone module 210, and the flash module 208 may all be positioned inthe rear-facing sensor region 116 (FIG. 1B), and may be configured tointerface with the exterior environment of the device 100 through thehole 200 and the cover member 132.

The device 100 may also include a bracket member 216 (also referred toherein as a camera bracket) to which the camera modules 202, 204 and thedepth sensor module 206 may be coupled. The bracket member (or camerabracket) 216 may define a first container portion 218 configured toreceive the first camera module 202, a second container portion 220configured to receive the second camera module 204, and a thirdcontainer portion 222 configured to receive the depth sensor module 206.Each container portion may define openings for the optical components ofthe camera modules and depth sensor modules. The container portions maydefine flanges or side walls that at least partially surround the cameramodules and the depth sensor module. The bracket member 216 may beconfigured to fix the relative positions of the camera modules and thedepth sensor module. For example, the relative positions and/ororientations of the camera modules and the depth sensor module may beimportant to ensure proper operation of the features and/or functions ofthe camera modules and the depth sensor module. For example, in somecases it is necessary or desirable for the optical axes of the cameramodules and the depth sensor module (where an optical axis may refer toa line that defines the path along which light propagates through thelenses of the modules) to be parallel or to converge at a predetermineddistance away from the device 100. As another example, it is necessaryor desirable for the offset between the camera modules and the depthsensor module (e.g., the offset along the optical axes) to be set at apredetermined distance. Such alignment and positioning may be necessaryor desirable to provide functions such as camera focus assistance, depthmapping, image processing, or the like, and employing a common structure(such as the bracket member 216) to which the camera modules and thedepth sensor module are coupled may help establish and maintain thedesired alignment and positioning. Notably, the bracket member 216 mayestablish and maintain any desired alignment, positioning, orientation,offset, or other spatial parameter, that results in the properfunctioning of the optical systems.

The device 100 may also include a frame member 224. The frame member 224may be positioned in the hole 200 and attached to the housing member130. The frame member 224 may improve the strength, stiffness, or otherphysical property of the housing member 130. For example, the framemember 224 may compensate for the reduced strength and/or stiffness ofthe housing member 130 resulting from the hole 200 being formed in thehousing member 130. The frame member 224 may define first, second, andthird openings 226, 228, 230 for the first camera module 202, the secondcamera module 204, and the depth sensor module 206, respectively. Theframe member 224 may also define a fourth opening 232 for the flashmodule 208 and a fifth opening 234 for the microphone module 210. Theopenings in the frame member 224 may at least partially receive therespective modules, and may provide optical, acoustic, or other accessthrough the frame member 224. The openings in the frame member 224 mayreceive other components as well. For example, a flash module trimmember 238 may be positioned in or adjacent the fourth opening 232, andmay help retain the flash module 208 (as well as a flash window 236) inplace.

The frame member 224 may be formed of or include steel, aluminum,magnesium, titanium, a polymer (e.g., a fiber-reinforced polymer), acomposite, or any other suitable material(s). The frame member 224 mayinclude a coating. For example, the frame member 224 may include adiamond-like carbon (DLC) coating, a metal or metallic coating, an oxidecoating, or any other suitable coating (applied using plasma vapordeposition (PVD), chemical vapor deposition (CVD), electroplating,etc.). In some cases, the frame member 224 is anodized, oxidized, orotherwise processed to produce an outer shell or layer having adifferent composition than an underlying portion of the frame member224. In some cases, the exterior coatings, layers, or other treatmentsmay provide a desired optical property, such as to impart a particularreflectance, color, or the like, to the surface of the frame member 224.In some cases, less than all of the surfaces of the frame member 224 arecoated as described above. For example, in some cases only theoutward-facing surfaces include a coating.

FIG. 2A also illustrates the cover member 132, which may overlie theframe member 224 and may define an exterior surface of the device 100.For example, the exterior surface of the cover member 132 may be acosmetic, exterior surface of the electronic device 100 in the area ofthe rear-facing sensor region 116. The cover member 132 may be formed ofsapphire, glass, polymer, ceramic, or the like. The cover member 132 maybe formed of a transparent material. In other implementations, the covermember 132 may be formed of an opaque or non-transparent material.

In some cases, some or all of the exterior or interior surfaces of thecover member 132 may include a coating such as a paint, ink, dye, sheet,film, or the like. Such coatings may be transparent, translucent, oropaque. In some cases, the coatings are discontinuous and/or defineregions along the cover member 132 having different optical properties.For example, a depth sensor window region 246 of the cover member 132may have different optical properties (e.g., different materials,different optical properties, different layers, etc.) than an areaoutside and/or surrounding the depth sensor window region 246. Forexample, the sensor window region 246 may be more optically transmissive(e.g., to the particular wavelength(s) of light emitted by the depthsensor and/or detected by the depth sensor) than regions surrounding thesensor window region 246, which may be opaque.

The cover member 132 may define openings in which other protectiveelements may be positioned. For example, the cover member 132 defines afirst opening 242 for the first camera module 202 and is configured toreceive a first camera window 250 therein. The cover member 132 alsodefines a second opening 244 for the second camera module 204 and isconfigured to receive a second camera window 252 therein. The first andsecond camera windows 250, 252 may cover the first and second cameramodules 202, 204, respectively, and may protect the camera modules 204,206 (and their lenses) from scratches or other damage or contaminants.The first and second openings 242, 244 of the cover member 132 may beconfigured to surround flanges or raised rims that extend around thefirst and second openings 226, 228 of the frame member 224, and thefirst and second camera windows 250, 252 may be coupled to ledges orother features of the frame member 224 within the flanges or raisedrims. Thus, in some cases, the exterior surface of the rear-facingsensor region 116 (in the area of the cameras, for example) may bedefined by a portion of the cover member 132, a top surface of a flangeor raised rim of the frame member 224, and a camera window 250, 252.

The cover member 132 may also define a third opening 248 for the flashmodule 208 and a fourth opening 254 for the microphone module 210. Theflash window 236 may extend at least partially into the third opening248 and may cover and/or protect the flash module 208 while allowinglight from the flash module 208 to exit the device 100. A microphonescreen 240 may be positioned at least partially in the fourth opening254 to cover and/or protect the microphone module 210 while allowingsound to enter into the device 100 from outside of the device 100.

FIG. 2B illustrates an example cross-sectional view of the device 100,viewed along line A-A in FIG. 1B. More particularly, FIG. 2B illustratesan example arrangement of a subset of the components associated with therear-facing sensor region 116 shown and described with respect to FIG.2A. Some of the components of the device 100 may be omitted from FIG. 2Bfor clarity.

FIG. 2B illustrates the raised rim 134 of the housing member 130. Asshown, the housing member 130 may define a fillet or curved surfaceextending from the back surface of the housing member 130 to the raisedrim 134. The raised rim 134 may surround and protect the side surfacesof the cover member 132. The top surface of the raised rim 134 (whichmay be planar) may be substantially flush with (or proud of) the topexterior surface of the cover member 132.

The frame member 224 may be attached to the housing member 130. Forexample, the housing member 130 may define a first support ledge 264,which may extend at least partially (and optionally completely) aroundthe inner surface of the hole 200 in the housing member 130. The framemember 224 may define a second support ledge 266 that is configured tooverlap and contact the first support ledge 264. In other cases, theframe member 224 lacks a distinct support ledge, and instead anotherportion of the frame member 224 rests on the first support ledge 264.The frame member 224 may be attached to the housing member 130 byinserting the frame member 224 into the hole 200 such that the secondsupport ledge 266 rests on the first support ledge 264 (with or withoutinterstitial layers such as adhesives, sealants, etc.), and thensecuring the frame member 224 to the housing member 130. Techniques forsecuring the frame member 224 to the housing member 130 are describedherein with respect to FIGS. 3C-3F. The positioning of the frame member224 relative to the housing member 130 may be defined by the positionand locations of the first and second support ledges 264, 266.

The cover member 132 may be attached to the frame member 224 to retainthe cover member 132 to the device 100. For example, the cover member132 may be attached to the frame member 224 via an adhesive 256.Techniques for attaching the cover member 132 to the frame member 224are described herein with respect to FIGS. 5A-5C.

FIG. 2B also illustrates how the frame member 224, the cover member 132,and the camera windows (e.g., the camera window 252) may be arranged.For example, the frame member 224 may define a raised rim 258, which mayextend through an opening (e.g., the opening 244) in the cover member132. The frame member 224 may also define a ledge within the raised rim258 that supports the camera window 252. When assembled, the covermember 132, the top surface of the raised rim 258, and the camera window252 may be substantially flush. In some cases, the raised rim 258 may beomitted, and the camera window 252 may be secured to the cover member132 within the opening 244 (e.g., the camera window 252 may abut or beattached to the cover member 132 within the opening 244). In othercases, the cover member 132 may not have an opening for a separatecamera window, but instead may include a transparent region above thecamera.

FIG. 2B also illustrates example configurations of the second cameramodule 204 and the depth sensor module 206, as well as the arrangementof the bracket member 216 relative to the frame member 224. For example,the container portions of the bracket member 216 may be positioned inrecesses, cavities, or other regions (defined by a network of ribs orflanges) of the frame member 224. As shown, the second camera module 204is positioned in the second container portion 220, and is aligned withan opening 260 in the bracket member 216, the second opening 228 in theframe member, and the second opening 244 in the cover member 132 (andthe camera window 252). Similarly, the depth sensor module 206 ispositioned in the third container portion 222, and is aligned with anopening 262 in the bracket member 216, the third opening 230 in theframe member, and the depth sensor window region 246 of the cover member132. As noted above, the depth sensor window region 246 may be a portionof the cover member 132 that has a different coating than anotherportion of the cover member 132 (or otherwise has optical propertiesthat allow the depth sensor module 206 to transmit and/or receive lightthrough the cover member 132).

FIGS. 3A-3B illustrate a portion of the housing 104 with the framemember 224 installed. (Other components are omitted from FIGS. 3A-3B.)As noted above, the frame member 224 may provide structural support tothe housing of the device 100. For example, the hole 200 in the housing104 may reduce the strength, stiffness, and/or overall structuralsoundness of the housing 104 in the area of the hole 200. Further, thearea of the housing 104 where the hole 200 is positioned is proximate anarea where a joint structure mechanically joins the housing member 130with the housing member 128, which may be weaker than areas that aredefined by uninterrupted metal materials.

These effects may be mitigated, however, by attaching the frame member224 to the housing 104 in the hole 200. Further, the configuration ofthe frame member 224 may help direct forces from impacts, drop events,or the like. For example, the frame member 224 may define ribs 300(indicated by the stippling pattern). The ribs 300 may define recessesor cavities along the back side (e.g., the interior-facing side) of theframe member 224. Components may be positioned in the recesses orcavities defined by the ribs 300, such as portions of the bracket member216, camera modules, and the like. The ribs 300 may define load pathsfrom the peripheral sides of the frame member 224 (e.g., the sides alongthe top and side of the device 100) to the main, central structuralportion of the housing member 130. More broadly, the ribs 300 may helpimprove the stiffness and/or strength of the housing 104 in the area ofthe hole 200, as compared to a frame member 224 without ribs, or ahousing that omits the frame member 224.

FIG. 3B illustrates how the ribs 300, and the frame member 224 moregenerally, improve the strength of the device 100 and/or its resistanceto deformation or damage in the event of an impact. More particularly,FIG. 3B shows the device 100 at the moment of impact with a surface 304(e.g., the ground). As shown, forces from the impact are transferred ordirected from the point of impact (e.g., the corner of the device 100)through the ribs 300, and to the main body of the housing member 130.Load path 302 illustrates one example load path extending from the sideof the housing 104 through the frame member 224 (though this is merelyrepresentative and is not intended to show the only load path). Statedanother way, the ribs 300 provide a structural support to the housingmember 130 in the area of the hole 200 to help prevent the housingmember 130 from collapsing, bending, deforming, or otherwise beingdamaged due to impacts.

In order for the frame member 224 to provide structural support to thehousing 104, the frame member 224 may be securely attached to thehousing. For example, the frame member 224 may be secured to the housingvia welding, adhesives, fasteners, mechanical interlocks, or any othersuitable technique. FIG. 3C illustrates a portion of the housing 104with the frame member 224 installed, showing example techniques forsecurely attaching the frame member 224 to the housing 104. As shown inFIG. 3C, the frame member 224 may be attached to the housing 104 viawelds and fasteners. For example, the frame member 224 may be welded (orsoldered, brazed, or the like) to the housing member 130 at attachmentlocations 306, 308, 310, and 312 (among other possible locations). Theframe member 224 may also be attached to the housing member 130 viafasteners 314, 316, and 318. The fasteners may be threaded fasteners,rivets, or any other suitable fastener.

FIG. 3D is a partial cross-sectional view of the device 100, viewedalong line B-B in FIG. 3C, showing how a fastener may secure the framemember 224 to the housing member 130. The fastener 314 may extendthrough a hole (e.g., a through-hole) in the housing member 130, andinto a hole (e.g., a threaded hole) in the frame member 224. Thefastener 314 may define a chamfered or angled surface 320 that isconfigured to contact the housing member 130 at the time of installation(and remain in contact with the housing member 130). By initiatingcontact between the chamfered surface 320 of the fastener 314 and thehousing member 130 upon assembly, a load applied to the housing 104(e.g., from a drop event) may be transferred through the fastener 314immediately upon impact. By contrast, a conventional screw or bolt(e.g., with a cylindrical shaft portion) may result in a clearance orgap between the through hole in the housing member 130 and the screw orbolt. Upon an impact, the presence of the clearance or gap may allow theframe member 224 to shift relative to the housing member 130, therebystraining other connections between the frame member 224 and the housing(such as the weld joints) and otherwise reducing the structuralintegrity of the device.

FIG. 3E is a partial cross-sectional view of the device 100, viewedalong line C-C in FIG. 3C, showing how a weldment may be used to securethe frame member 224 to the housing member 130. In particular, the framemember 224 may be positioned proximate the housing member 130 and anoptional weld bracket 322. The frame member 224 may be fastened to theweld bracket 322 via a weld bead 324. The weld bracket 322 may beattached to the frame member 224 via any suitable technique, such aswelding, brazing, fusion bonding, soldering, adhesives, rivets, or thelike. In some cases, the weld bracket 322 is part of the housing member130, rather than being a separate component as shown in FIG. 3E (e.g.,the weld bracket 322 and the housing member 130 may be part of a singleunitary structure). While FIG. 3E illustrates a weld along a butt jointbetween the frame member 224 and the housing member 130, welds may alsobe applied to or used with other types of joints, such as lap joints,interlocks, or the like.

FIG. 3F illustrates an attachment technique that may be used with analternative frame member configuration. FIG. 3F is a partialcross-sectional view of a device, viewed along a line similar to lineC-C in FIG. 3E. As shown in FIG. 3F, a frame member 326 may define afront flange 328 that is configured to engage an exterior surface of thehousing member 334. The frame member 326 and the housing member 334 maybe similar in other respects to the frame member 224 and the housingmember 130, and for brevity details of those components will not berepeated here. The frame member 326 may also define an angled surface330 that is configured to overlap at least a portion of the housingmember 334. A wedge component 332 may be positioned between the angledsurface 330 and the housing member 334. The wedge component 332 mayforce the frame member 326 upwards (relative to the orientation shown inFIG. 3F), thereby producing an engagement force between the front flange328 and the exterior surface of the housing member 334 and tending torigidly retain the frame member 326 to the housing member 334. The angleof the angled surface 330 and the wedge member 332 (as well as thematerials and/or surface textures of the angled surface 330 and thewedge member 332) may be selected to produce a self-locking interface,in which downward forces applied to the frame member 326 (relative tothe orientation shown in FIG. 3F) do not cause the wedge member 332 tobe forced out of position (e.g., to the right as depicted in FIG. 3F).In some cases, the wedge member 332 is secured to the frame member 326and/or the housing member 334, such as via welding, soldering, brazing,fasteners, adhesives, mechanical interlocks, or the like.

FIGS. 4A-4C illustrate details of the bracket member 216 and itsintegration with the device 100. FIG. 4A, for example, depicts aperspective view of the bracket member 216. As described above, thebracket member 216 defines container portions 218, 220, 222 configuredto receive the first and second camera modules 202, 204, and the depthsensor module 206. The bracket member 216 may also define openings 402,404, 406 to allow the camera modules and the depth sensor module accessto the external environment through the bracket member 216. The bracketmember 216 may also define a sensor opening 400, which may be alignedwith a sensor (e.g., the sensor 110). More particularly, the bracketmember 216 may be positioned between the sensor 110 and the display ofthe device 100, and as such is in a position that may otherwiseinterfere with the sensing function of the sensor 110. The sensoropening 400 may allow the sensor 110 to sense objects that are proximatethe display 103 and cover 102 of the device 100. For example, the sensoropening 400 may allow magnetic fields from a magnet of a cover accessoryto reach the sensor 110 and allow the sensor 110 to detect the presenceand/or absence of the magnetic field.

FIG. 4B is a partial exploded view of the device 100, showing thebracket member 216 removed decoupled from the device 100. As shown inFIG. 4B, the device 100 may include a circuit board 408, on which thesensor 110 may be positioned. The portion of the circuit board 408 withthe sensor 110 may extend under the bracket member 216 such that thesensor 110 is positioned under the opening 400.

FIG. 4B also illustrates how the container portions of the bracketmember 216 may nest in the corresponding container portions defined bythe ribs 300 of the frame member 224, and also shows the first andsecond camera modules 202, 204 and the depth sensor module 206 abovetheir respective container portions of the bracket member 216. As shown,the first and second camera modules 202, 204 and the depth sensor module206 may be coupled to one or more circuit elements 412 (e.g., flexiblecircuit boards), which may include connectors that attach to the circuitboard 408. A switch module 410 may also include a circuit element (e.g.,a flexible circuit board) that extends over or integrates with thecircuit elements of the first and second camera modules 202, 204 and thedepth sensor module 206 and electrically couples to the circuit board408.

FIG. 4C shows a portion of the device 100 with the bracket member 216installed in the device. The first and second camera modules 202, 204and the depth sensor module 206 are omitted for clarity.

As described above, the cover member 132 may be attached to the device100 by adhering the cover member 132 to the frame member 224. FIGS.5A-5B illustrate an example process by which the cover member 132 may beattached to the frame member 224. In particular, the adhesive 256 may bedeposited on a bottom surface of the cover member 132 (and/or onto a topsurface of the frame member 224), and the cover member 132 may bepressed into the hole 200 and onto the top surface of the frame member224 using a press 500. The press 500 may be heated, and may be used toheat the adhesive 256 before, during, and/or after the process ofpressing the cover member 132 onto the frame member 224. For example,the adhesive 256 may be a heat activated adhesive, and the heat from thepress 500 may cause the adhesive 256 to adhere to the cover member 132and the frame member 224.

The press 500 may be configured to position the cover member 132 in thehole 200 so that the exterior surface of the cover member 132 is flush(e.g., to within 25 microns) with the top surface of the raised rim 134.For example, when the press 500 is moved downward (indicated by thearrows 504) and the cover member 132 is positioned in the hole 200, abottom surface 502 of the press 500 (which is essentially flush with theexterior surface of the cover member 132) comes into contact with and istravel-limited by the top surface of the raised rim 134, as shown inFIG. 5B. At this point, the exterior surface of the cover member 132 isflush with the top surface of the raised rim 134. The adhesive 256 maybe allowed to cure to retain the cover member 132 in this position.

Due to manufacturing and material variabilities, the distance betweenthe top surface of the frame member 224 and the top surface of theraised rim 134 may vary between different devices. Accordingly, thestructure of the device 100 and the process described with respect toFIGS. 5A-5C are configured to accommodate such dimensional differenceswhile still consistently producing devices in which the cover member 132is flush with the raised rim 134. This may be accomplished, for example,by providing a sufficient amount of adhesive 256 to accommodatedifferent sized gaps between the top of the frame member 224 and thebottom of the cover member 132 (when the top of the cover member 132 isflush with the raised rim 134). FIG. 5A illustrates the adhesive 256having a thickness 506. When the cover member 132 is positioned in placeby the press 500, as shown in FIG. 5B, the adhesive 256 is compressedsomewhat (e.g., to thickness 508, matching the gap between the covermember 132 and the frame member 224), ensuring that the adhesive 256makes intimate contact with the surface of the frame member 224. Thisprocess also results in the adhesive 256 flowing or expanding laterallya certain amount, as defined by the amount of the adhesive 256 and theactual gap between the components.

In cases where the gap between the cover member 132 and the frame member224 is greater than or less than that shown in FIG. 5B, the adhesive 256may flow laterally by different amounts in order to accommodate thedifferent gap sizes. FIG. 5C, for example, shows an example in which thehousing 130, frame member 224, and cover member 132 result in a gap sizeof 510 (larger than the gap in FIG. 5B). Due to the ability of theadhesive 256 to flow laterally, along with the initial height 506 of theadhesive 256 being greater than the gap size 510, the adhesive 256 cansuccessfully secure the cover member 132 to the frame member 224 despitethe different gap size and while still positioning the cover member 132so that the exterior surface of the cover member 132 is flush with thetop surface of the raised rim 134. In cases where the gap size issmaller than that shown in FIG. 5B, the adhesive 256 may flow laterallymore than shown in FIG. 5B. Furthermore, other types of irregularitiesmay also be accommodated using this assembly technique. For example,variations in a flatness of the cover member 132, the frame member 224,the ledges of the frame member 224, and/or the ledges of the housingmember 130 may result in a non-uniform gap size between the cover member132 and the frame member 224. The ability of the adhesive to flow (aswell as the attachment process using the raised rim 134 as a datum forthe positioning of the cover member 132) allows the non-uniform gapsizes to be accommodated while maintaining the flushness of the covermember 132 and the raised rim 134.

The height 506 of the adhesive 256 may be selected to accommodate arange of potential gap sizes. For example, the height 506 may be about100 microns, about 150 microns, about 200 microns, about 250 microns, orany other suitable height. In some cases, the particular height ofadhesive may be selected based on one or more measurements of thecomponents of the device 100. For example, before application of theadhesive 256 to the cover member 132, components such as the covermember 132, the frame member 224, and/or the housing member 130 may bemeasured (either in an unassembled or partially assembled state). Basedon the measurement, if a gap between the cover member 132 and the framemember 224 is measured or estimated to be greater than a thresholdvalue, a first thickness of adhesive is applied (e.g., about 200microns), and if it is measured or estimated to be less than a thresholdvalue, a second thickness of adhesive is applied (e.g., about 150microns). Other thicknesses are also contemplated.

While FIGS. 5A-5C illustrate adhesive around the perimeter of the bottomsurface of the cover member 132, this is merely one configuration orpositioning of the adhesive. For example, in some cases the adhesive 256may be deposited in a web-like or other pattern more complex than simplya single path around an outer perimeter. For example, FIG. 7Aillustrates an adhesive application pattern that may be used to securethe cover member 132 to the frame member 224.

In compact electronic devices, such as tablet computers, the closeproximity of various electrical components may require shielding andother techniques to mitigate or eliminate the effects of electricalnoise or other interference on various systems. A depth sensor module206, for example, may include a high-frequency oscillator that mayproduce electromagnetic noise that may interfere with other electronicsor circuits of the device 100. Accordingly, the depth sensor module 206may be shielded and/or grounded to help reduce or mitigate the negativeeffects of the noise.

FIGS. 6A-6C illustrate an example technique for effectively shieldingand grounding the depth sensor module 206. FIG. 6A, for example,illustrates a partial view of the device 100, showing the housing withthe frame member 224 installed in the housing member 130. The device 100may include a conductive cowling 600 coupled to the frame member 224.The cowling 600 is formed from a conductive material, such as a copper,gold, or other flexible metal foil or film. The cowling 600 defines anopening that is aligned with or otherwise coincides with the opening 230in the frame member 224 and which is configured to allow the depthsensor module 206 access to the exterior environment. The cowling 600may be configured to contact and conductively couple to a housing of thedepth sensor module 206 as well as to the frame member 224 (which may beconductively coupled to a ground plane of the device 100). Thus, thecowling 600 defines a conductive path from the depth sensor module 206to an electrical ground, thereby helping prevent interference from thedepth sensor module 206 from affecting other circuits or components ofthe device 100.

As shown with respect to FIGS. 6B-6C, when the depth sensor module 206is coupled to the device 100, it may be forced against the cowling 600such that the cowling 600 deforms. The cowling 600 may define a seriesof conductive tabs 601 separated from one another by spaces 602. Thetabs 601 may facilitate the cowling 600 deforming to conform against thedepth sensor module 206 as the depth sensor module 206 is installed,while helping prevent and/or avoid buckling, curling, or other unwanteddeformations that may distort the cowling 600 in a manner that may bedetrimental to the function of the cowling 600.

FIG. 6B is a partial cross-sectional view of the device 100, viewedalong line D-D in FIG. 6A, showing the depth sensor module 206 prior toinstallation in the device 100. FIG. 6B shows the cowling 600 attachedto the frame member 224 along a surface around the opening 230 in theframe member 224. The cowling 600 may be conductively coupled to theframe member 224 in this area via conductive adhesive, brazing,soldering, or any other technique that retains the cowling 600 to theframe member 224 and facilitates a conductive coupling between thesecomponents. A foam 603 (or other compliant material) may be positionedbetween the cowling 600 and the cover member 132 (e.g., below the tabs601 that extend over and/or into the opening). The foam 603 may beconfigured to deform when the depth sensor module 206 is put intoposition in the device and to provide a biasing force between the tabs601 and the depth sensor module 206 (e.g., to bias the tabs 601 againstthe depth sensor module 206, thereby maintaining a physical andconductive coupling between the tabs 601 and the depth sensor module206).

FIG. 6C is a partial cross-sectional view of the device 100, viewedalong line D-D in FIG. 6A, showing the depth sensor module 206 afterinstallation in the device 100. As shown, the cowling 600 has deformed(e.g., the tabs 601 of the cowling 600), as has the foam 603. The tabs601 have conformed to the contour of the depth sensor module 206, andthe foam 603 helps define the contour and maintain the tabs 601 inconformance and contact with the depth sensor module 206.

FIG. 6D is a perspective view of the depth sensor module 206, showingadditional components that may be used to shield the depth sensor module206. In particular, a flexible conductive material 614 (e.g., a coppertape) may be wrapped around at least a portion of the depth sensormodule 206, such as around at least two sides of the depth sensor module206. The conductive material 614 may also extend over a top of the depthsensor module 206 and along the top surface of a flexible circuitelement 612 that interconnects the depth sensor module 206 with othercircuit elements of the device (e.g., via a connector 616). Theconductive material 614 may be conductively coupled to a ground plane ofthe device 100 to facilitate the shielding function of the conductivematerial 614.

As noted above, the cover member 132 may be attached to the frame member224 using an adhesive 256. The adhesive 256 may be arranged in a patternthat provides a large surface area for the adhesive 256 to bond to, bothon the cover member 132 and the frame member 224. FIG. 7A illustrates aportion of the device 100 that includes the rear-facing sensor region116, illustrating an example application pattern for the adhesive 256.As shown, the adhesive 256 at least partially surrounds the variouscomponents of the rear-facing sensor region 116. For example, theadhesive 256 extends around the first camera 118, the second camera 120,the flash 122, the depth sensor 126, and the microphone 124. Bydepositing the adhesive 256 in this way, the cover member 132 may besecurely attached to the device 100.

The adhesive 256 may perform other functions in addition to securing thecover member 132 to the frame member 224. For example, the adhesive 256may surround the microphone 124 (or an area associated with themicrophone 124) to help define a sealed audio path extending from theexterior environment to the microphone module within the device 100.FIG. 7B illustrates a detail view of the rear-facing sensor region 116corresponding to area E-E in FIG. 7A. FIG. 7B illustrates the pattern ofthe adhesive 256 around the microphone region. FIG. 7B also shows aboundary of a recess 700 that is formed in the frame member 224 and thatforms part of the acoustic path leading from the opening 254 in thecover member 132 to the opening 234 in the frame member 224. Notably,the opening 254 is offset from (e.g., is not coaxial with) the opening234. Accordingly, as described with respect to FIG. 7C, the acousticpath from the exterior environment to the microphone module 210 may benon-linear and may pass through a chamber or volume defined between thecover member 132 and the frame member 224 (with the path including therecess 700 of the frame member 224). FIG. 7B also illustrates the outerboundary of the microphone screen 240 that may cover the opening 254 inthe cover member 132.

FIG. 7C is a partial cross-sectional view of the device 100, viewedalong line F-F in FIG. 7B. As shown, an acoustic path 706 is definedfrom the exterior of the device 100 to the diaphragm 712 (or othersensing element) of the microphone module 210 (which may be positionedin a recess 708 defined by the frame member 224). The acoustic path 706extends through a volume 704 defined in part by the recess 700 and thecover member 132. The acoustic path 706 also extends through themicrophone screen 240, which may be positioned in the opening 254 of thecover member 132. The microphone screen 240 may be attached to the covermember 132 with an adhesive 702, and may define a deformed portion thatextends into the opening 254 and defines an exterior portion that isflush with the exterior surface of the cover member 132 (though in someembodiments it may be recessed or proud relative to the exterior surfaceof the cover member 132).

The volume through which the acoustic path 706 extends may be a sealedor enclosed volume, with the exception of the opening 254 in the covermember 132. For example, the adhesive 256 that attaches the cover member132 to the frame member 224 may extend around the perimeter of therecess 700, as shown in FIG. 7B, thereby enclosing and/or sealing thevolume 704 from other environments (e.g., the exterior environment andthe internal volume of the device 100). Similarly, the microphone module210 may be attached to the frame member 224 via an adhesive 710 (e.g., apressure-sensitive adhesive), which may extend around the opening 234 inthe frame member 224 to enclose and/or seal the joint between themicrophone module 210 and the frame member 224. By sealing the volumethrough which the acoustic path 706 extends, interference from bothinternal and external sources of audible interference may be avoided. Insome cases, the sealing provided by the adhesives 256 and 710 is awatertight seal and/or a hermetic seal.

As noted above, the frame member 224 may include a coating, such as aDLC coating, along at least the outward-facing surfaces of the framemember 224 (e.g., the top surfaces as depicted in FIG. 7C). In somecases, the surface of the recess 700 lacks the coating. For example, acoating such as a DLC coating may be applied to the frame member 224after the recess 700 is formed in the frame member 224 (e.g., bymachining). The DLC coating may then be locally removed from areas ofthe frame member 224, such as from the surface of the recess 700, areaswhere adhesive is applied to the frame member 224, or the like.

FIG. 8A is a top view of an example optical sensor assembly 800 that maybe used for the depth sensor 126. The sensor assembly 800 may include anoptical sensor 802 (e.g., a charge coupled device (CCD) sensor, acomplementary metal oxide semiconductor (CMOS) sensor, or any othersuitable type of sensor. The optical sensor 802 may be attached to asubstrate 804, and may be conductively coupled (through the substrate804) to one or more connection pads, such as connection pad 806. Thesensor assembly 800 may also include a flexible circuit board 808, whichmay include connection pads that conductively couple to the connectionpads on the substrate 804, as well as conductive traces that facilitateconductive coupling between the sensor 802 and other components.

FIG. 8B is a partial cross-sectional view of the optical sensor assembly800, viewed along line G-G in FIG. 8A. The flexible circuit board 808may include a flexible substrate 814 (which may include one or moresub-layers, such as one or more polyimide sheets, adhesive layers, andthe like). The flexible circuit board 808 may also include connectionpads 810 that are exposed along the top surface of the flexible circuitboard 808 and are configured to be conductively coupled to theconnection pads (e.g., the connection pad 806) of the substrate 804. Theflexible circuit board 808 may also include components 816 (e.g.,electrical traces, connection pads, circuit elements, or othercomponents) that are coupled to a surface of the flexible circuit board808 but are not intended to be conductively coupled to the substrate804. Accordingly, such components 816 may be covered by a coverlay 818,which may protect and electrically insulate the components 816.

The flexible circuit board 808 may be coupled to the substrate 804 usinga conductive adhesive 807, such as an anisotropic conductive film. Theconductive adhesive 807 may both bond the flexible circuit board 808 tothe substrate 804, and also conductively couple the connection pads 806to the connection pads 810.

In some cases, the coverlay 818 on the top surface of the flexiblecircuit board 808 may cause the flexible circuit board 808 to bend ordeform when the flexible circuit board 808 is coupled to the substrate804. FIG. 8B illustrates such a condition, where the flexible circuitboard 808 has deformed in the areas around the coverlay 818 toaccommodate the extra thickness of the coverlay 818 on the top surface.This configuration may strain the flexible circuit board 808 as well asthe adhesive joints between the connection pads 806 and the connectionpads 810.

FIGS. 8C-8D are partial cross-sectional views the optical sensorassembly 800 using a different flexible circuit board configuration. Inparticular, instead of mounting components 816 on the top exteriorsurface of a flexible substrate 814, and then applying a coverlay 818over the components 816 (which adds additional height to the flexiblecircuit board in the area of the coverlay), FIGS. 8C-8D show a flexiblecircuit board 820 in which components 832 are sandwiched betweenmultiple substrate layers of the flexible circuit board 820.

FIG. 8C shows the flexible circuit board 820 prior to being attached tothe substrate 804. As shown, the flexible circuit board 820 includescomponents 832 (e.g., electrical traces, connection pads, circuitelements, or other components) between a first substrate layer 831 and asecond substrate layer 833. The first and second substrate layers may bepolyimide layers that are adhered together after positioning thecomponents 832 therebetween. Connection pads 822 may be exposed on a topsurface of the flexible circuit board 820 so they can be conductivelycoupled to the connection pads 806 on the substrate 804. The flexiblecircuit board 820 may also include vias 830 to conductively couple theexternal connection pads 822 to other traces, circuit elements, or othercomponents that are between the first and second substrate layers 831,833, or on the bottom surface of the flexible circuit board 820. Theflexible circuit board 820 may also include components 826 (e.g.,electrical traces, connection pads, circuit elements, or othercomponents) on the bottom surface of the flexible circuit board 820,portions of which may be covered by a coverlay 828 (e.g., to protectand/or electrically insulate the components 826).

The configuration of the flexible circuit board 820 results in a topside that is significantly flatter than the flexible circuit board 808in FIG. 8B. In particular, by using multiple laminations and positioningcomponents between the laminations (instead of on top of the flexiblesubstrates), the need for an exterior coverlay on the top surface can beeliminated. FIG. 8D illustrates the optical sensor assembly 800 with theflexible circuit board 820 attached. As shown, the conductive adhesive807 bonds the flexible circuit board 820 to the substrate 804, and alsoconductively couples the connection pads 822 to the connection pads 810.Unlike the flexible circuit board 808 in FIG. 8B, however, the flexiblecircuit board 820 does not significantly deform, flex, or bend whenattached to the substrate 804. Rather, the flexible circuit board 820remains substantially flat and/or undeformed, thereby resulting in aless strained flexible circuit board 820 and reducing the likelihood ofdelamination, breaking, or other potential damage.

FIG. 9 depicts an example schematic diagram of an electronic device 900.The electronic device 900 may be an embodiment of or otherwise representthe device 100 (or any other device(s) described herein). The device 900includes one or more processing units 901 that are configured to accessa memory 902 having instructions stored thereon. The instructions orcomputer programs may be configured to perform one or more of theoperations or functions described with respect to the electronic devicesdescribed herein. For example, the instructions may be configured tocontrol or coordinate the operation of one or more displays 908, one ormore touch sensors 903, one or more force sensors 905, one or morecommunication channels 904, one or more audio input systems 909, one ormore audio output systems 910, one or more positioning systems 911, oneor more sensors 912, and/or one or more haptic feedback devices 906.

The processing units 901 of FIG. 9 may be implemented as any electronicdevice capable of processing, receiving, or transmitting data orinstructions. For example, the processing units 901 may include one ormore of: a microprocessor, a central processing unit (CPU), anapplication-specific integrated circuit (ASIC), a digital signalprocessor (DSP), or combinations of such devices. As described herein,the term “processor” is meant to encompass a single processor orprocessing unit, multiple processors, multiple processing units, orother suitably configured computing element or elements. The processingunits 901 may be coupled to a circuit board, such as the circuit board408 (FIG. 4B), or a different circuit board.

The memory 902 can store electronic data that can be used by the device900. For example, a memory can store electrical data or content such as,for example, audio and video files, images, documents and applications,device settings and user preferences, programs, instructions, timing andcontrol signals or data for the various modules, data structures ordatabases, and so on. The memory 902 can be configured as any type ofmemory. By way of example only, the memory can be implemented as randomaccess memory, read-only memory, Flash memory, removable memory, orother types of storage elements, or combinations of such devices.

The touch sensors 903 may detect various types of touch-based inputs andgenerate signals or data that are able to be accessed using processorinstructions. The touch sensors 903 may use any suitable components andmay rely on any suitable phenomena to detect physical inputs. Forexample, the touch sensors 903 may be capacitive touch sensors,resistive touch sensors, acoustic wave sensors, or the like. The touchsensors 903 may include any suitable components for detectingtouch-based inputs and generating signals or data that are able to beaccessed using processor instructions, including electrodes (e.g.,electrode layers), physical components (e.g., substrates, spacinglayers, structural supports, compressible elements, etc.) processors,circuitry, firmware, and the like. The touch sensors 903 may beintegrated with or otherwise configured to detect touch inputs appliedto any portion of the device 900. For example, the touch sensors 903 maybe configured to detect touch inputs applied to any portion of thedevice 900 that includes a display (and may be integrated with adisplay). The touch sensors 903 may operate in conjunction with theforce sensors 905 to generate signals or data in response to touchinputs. A touch sensor or force sensor that is positioned over a displaysurface or otherwise integrated with a display may be referred to hereinas a touch-sensitive display, force-sensitive display, or touchscreen.

The force sensors 905 may detect various types of force-based inputs andgenerate signals or data that are able to be accessed using processorinstructions. The force sensors 905 may use any suitable components andmay rely on any suitable phenomena to detect physical inputs. Forexample, the force sensors 905 may be strain-based sensors,piezoelectric-based sensors, piezoresistive-based sensors, capacitivesensors, resistive sensors, or the like. The force sensors 905 mayinclude any suitable components for detecting force-based inputs andgenerating signals or data that are able to be accessed using processorinstructions, including electrodes (e.g., electrode layers), physicalcomponents (e.g., substrates, spacing layers, structural supports,compressible elements, etc.) processors, circuitry, firmware, and thelike. The force sensors 905 may be used in conjunction with variousinput mechanisms to detect various types of inputs. For example, theforce sensors 905 may be used to detect presses or other force inputsthat satisfy a force threshold (which may represent a more forcefulinput than is typical for a standard “touch” input) Like the touchsensors 903, the force sensors 905 may be integrated with or otherwiseconfigured to detect force inputs applied to any portion of the device900. For example, the force sensors 905 may be configured to detectforce inputs applied to any portion of the device 900 that includes adisplay (and may be integrated with a display). The force sensors 905may operate in conjunction with the touch sensors 903 to generatesignals or data in response to touch- and/or force-based inputs.

The device 900 may also include one or more haptic devices 906. Thehaptic device 906 may include one or more of a variety of haptictechnologies such as, but not necessarily limited to, rotational hapticdevices, linear actuators, piezoelectric devices, vibration elements,and so on. In general, the haptic device 906 may be configured toprovide punctuated and distinct feedback to a user of the device. Moreparticularly, the haptic device 906 may be adapted to produce a knock ortap sensation and/or a vibration sensation. Such haptic outputs may beprovided in response to detection of touch and/or force inputs, and maybe imparted to a user through the exterior surface of the device 900(e.g., via a glass or other surface that acts as a touch- and/orforce-sensitive display or surface).

The one or more communication channels 904 may include one or morewireless interface(s) that are adapted to provide communication betweenthe processing unit(s) 901 and an external device. The one or morecommunication channels 904 may include antennas (e.g., antennas thatinclude or use the housing members of the housing 104 as radiatingmembers), communications circuitry, firmware, software, or any othercomponents or systems that facilitate wireless communications with otherdevices. In general, the one or more communication channels 904 may beconfigured to transmit and receive data and/or signals that may beinterpreted by instructions executed on the processing units 901. Insome cases, the external device is part of an external communicationnetwork that is configured to exchange data with wireless devices.Generally, the wireless interface may communicate via, withoutlimitation, radio frequency, optical, acoustic, and/or magnetic signalsand may be configured to operate over a wireless interface or protocol.Example wireless interfaces include radio frequency cellular interfaces(e.g., 2G, 3G, 4G, 4G, 4G long-term evolution (LTE), 5G, GSM, CDMA, orthe like), fiber optic interfaces, acoustic interfaces, Bluetoothinterfaces, infrared interfaces, USB interfaces, Wi-Fi interfaces,TCP/IP interfaces, network communications interfaces, or anyconventional communication interfaces. The one or more communicationschannels 904 may also include ultra-wideband (UWB) interfaces, which mayinclude any appropriate communications circuitry, instructions, andnumber and position of suitable UWB antennas.

As shown in FIG. 9, the device 900 may include a battery 907 that isused to store and provide power to the other components of the device900. The battery 907 may be a rechargeable power supply that isconfigured to provide power to the device 900. The battery 907 may becoupled to charging systems (e.g., wired and/or wireless chargingsystems) and/or other circuitry to control the electrical power providedto the battery 907 and to control the electrical power provided from thebattery 907 to the device 900.

The device 900 may also include one or more displays 908 configured todisplay graphical outputs. The displays 908 may use any suitable displaytechnology, including liquid crystal displays (LCD), organic lightemitting diodes (OLED), active-matrix organic light-emitting diodedisplays (AMOLED), or the like. The displays 908 may display graphicaluser interfaces, images, icons, or any other suitable graphical outputs.The display 908 may correspond to the display 103.

The device 900 may also provide audio input functionality via one ormore audio input systems 909. The audio input systems 909 may includemicrophones, transducers, or other devices that capture sound for voicecalls, video calls, audio recordings, video recordings, voice commands,and the like.

The device 900 may also provide audio output functionality via one ormore audio output systems (e.g., speakers) 910. The audio output systems910 may produce sound from voice calls, video calls, streaming or localaudio content, streaming or local video content, or the like.

The device 900 may also include a positioning system 911. Thepositioning system 911 may be configured to determine the location ofthe device 900. For example, the positioning system 911 may includemagnetometers, gyroscopes, accelerometers, optical sensors, cameras,global positioning system (GPS) receivers, inertial positioning systems,or the like. The positioning system 911 may be used to determine spatialparameters of the device 900, such as the location of the device 900(e.g., geographical coordinates of the device), measurements orestimates of physical movement of the device 900, an orientation of thedevice 900, or the like.

The device 900 may also include one or more additional sensors 912 toreceive inputs (e.g., from a user or another computer, device, system,network, etc.) or to detect any suitable property or parameter of thedevice, the environment surrounding the device, people or thingsinteracting with the device (or nearby the device), or the like. Forexample, a device may include temperature sensors, biometric sensors(e.g., fingerprint sensors, photoplethysmographs, blood-oxygen sensors,blood sugar sensors, or the like), eye-tracking sensors, retinalscanners, humidity sensors, buttons, switches, lid-closure sensors, orthe like.

To the extent that multiple functionalities, operations, and structuresdescribed with reference to FIG. 9 are disclosed as being part of,incorporated into, or performed by the device 900, it should beunderstood that various embodiments may omit any or all such describedfunctionalities, operations, and structures. Thus, different embodimentsof the device 900 may have some, none, or all of the variouscapabilities, apparatuses, physical features, modes, and operatingparameters discussed herein. Further, the systems included in the device900 are not exclusive, and the device 900 may include alternative oradditional systems, components, modules, programs, instructions, or thelike, that may be necessary or useful to perform the functions describedherein.

It is well understood that the use of personally identifiableinformation should follow privacy policies and practices that aregenerally recognized as meeting or exceeding industry or governmentalrequirements for maintaining the privacy of users. In particular,personally identifiable information data should be managed and handledso as to minimize risks of unintentional or unauthorized access or use,and the nature of authorized use should be clearly indicated to users.

The foregoing description, for purposes of explanation, used specificnomenclature to provide a thorough understanding of the describedembodiments. However, it will be apparent to one skilled in the art thatthe specific details are not required in order to practice the describedembodiments. Thus, the foregoing descriptions of the specificembodiments described herein are presented for purposes of illustrationand description. They are not targeted to be exhaustive or to limit theembodiments to the precise forms disclosed. It will be apparent to oneof ordinary skill in the art that many modifications and variations arepossible in view of the above teachings. Also, when used herein to referto positions of components, the terms above, below, over, under, left,or right (or other similar relative position terms), do not necessarilyrefer to an absolute position relative to an external reference, butinstead refer to the relative position of components within the figurebeing referred to.

What is claimed is:
 1. A tablet computing system comprising: a housingmember defining: a first portion of a back exterior surface of thetablet computer; at least a portion of a side exterior surface of thetablet computer; a raised rim extending from the back exterior surfaceand at least partially defining a sensor assembly hole extending throughthe housing member; and a support ledge positioned in the sensorassembly hole; a frame member positioned at least partially in thesensor assembly hole and coupled to the support ledge; a camera bracketcoupled to the frame member; a first camera module coupled to the camerabracket; a second camera module coupled to the camera bracket, thecamera bracket fixing the relative positions of the first camera moduleand the second camera module; and a cover member positioned in thesensor assembly hole and attached to the frame member, an exteriorsurface of the cover member defining a second portion of the backexterior surface of the tablet computing system.
 2. The tablet computingsystem of claim 1, wherein: the raised rim defines a planar top surface;and the exterior surface of the cover member is flush with or recessedrelative to the planar top surface of the raised rim.
 3. The tabletcomputing system of claim 1, wherein the frame member defines a networkof ribs configured to transfer impact force from a first portion of thehousing member to a second portion of the housing member.
 4. The tabletcomputing system of claim 3, wherein the frame member is fusion bondedto the housing member.
 5. The tablet computing system of claim 1,wherein: the cover member defines: a first hole aligned with the firstcamera module; and a second hole aligned with the second camera module;and the tablet computing system further comprises: a first transparentcamera window positioned in the first hole and covering the first cameramodule; and a second transparent camera window positioned in the secondhole and covering the second camera module.
 6. The tablet computingsystem of claim 1, wherein: the frame member defines: a first datumsurface; and a second datum surface; and the tablet computing systemfurther comprises: a first spring configured to apply a first force tothe camera bracket in a first direction, thereby forcing the camerabracket against the first datum surface; and a second spring configuredto apply a second force to the camera bracket in a second directiondifferent from the first direction, thereby forcing the camera bracketagainst the second datum surface.
 7. The tablet computing system ofclaim 1, wherein: the tablet computing system comprises a depth sensorcoupled to the camera bracket and configured to determine a distancebetween the tablet computing system and an external object; and thecover member defines: an optically transmissive window region positionedover the depth sensor; and an opaque region at least partiallysurrounding the optically transmissive window region.
 8. A tabletcomputing system comprising: a housing member defining: at least aportion of a back exterior surface of the tablet computing system; and araised rim extending from the back exterior surface and at leastpartially defining a sensor assembly hole extending through the housingmember; and a frame member positioned at least partially in the sensorassembly hole and coupled to the housing member, the frame memberdefining: a first recess in a front side of the frame member; a secondrecess in a rear side of the frame member; and a first hole extendingthrough the frame member from the first recess to the second recess; acover member positioned in the sensor assembly hole and attached to theframe member, the cover member defining a second hole extending throughthe cover member; and a microphone module positioned in the secondrecess of the frame member and configured to receive sound via anacoustic path extending through the first hole in the frame member, avolume defined between the first recess and the cover member, and thesecond hole in the cover member.
 9. The tablet computing system of claim8, wherein the first hole and the second hole are not coaxial.
 10. Thetablet computing system of claim 8, wherein: the cover member isattached to the frame member with an adhesive; and the adhesivesurrounds the first recess and defines a hermetic seal between the framemember and the cover member around the first recess.
 11. The tabletcomputing system of claim 10, wherein: the adhesive is a first adhesive;the microphone module is attached to the frame member with a secondadhesive; and the second adhesive defines a hermetic seal between theframe member and the microphone module.
 12. The tablet computing systemof claim 11, wherein the first and second adhesives hermetically sealthe acoustic path from an internal volume of the tablet computingsystem.
 13. The tablet computing system of claim 11, further comprisinga microphone screen coupled to the cover member and covering the secondhole.
 14. The tablet computing system of claim 8, wherein: the covermember defines a third hole extending through the cover member; and thetablet computing system further comprises: a flash module coupled to theframe member; and a flash window positioned in the third hole andcovering the flash module.
 15. An electronic device comprising: ahousing member defining: a first portion of a back exterior surface ofthe electronic device; and a raised rim extending from the back exteriorsurface and at least partially defining a sensor assembly hole extendingthrough the housing member; and a frame member positioned at leastpartially in the sensor assembly hole and coupled to the housing member;a camera bracket coupled to the frame member; a first camera modulecoupled to the camera bracket and comprising a camera lens having afirst focal length; a second camera module coupled to the camera bracketand comprising a camera lens having a second focal length different fromthe first focal length; a depth sensor module coupled to the camerabracket and comprising: an optical emitter; and an optical sensorconfigured to detect light emitted by the optical emitter and reflectedby an object external to the electronic device; and a cover memberpositioned in the sensor assembly hole and defining a second portion ofthe back exterior surface of the electronic device.
 16. The electronicdevice of claim 15, wherein: the frame member defines a depth sensorhole configured to receive at least a portion of the depth sensormodule; and the electronic device further comprises: a conductivecowling at least partially surrounding the depth sensor hole anddefining a plurality of conductive tabs extending into the depth sensorhole; and a compliant material configured to bias the plurality ofconductive tabs against the depth sensor module.
 17. The electronicdevice of claim 16, wherein: the frame member is conductively coupled toa ground plane of the electronic device; and the depth sensor module isconductively coupled to the frame member via the conductive cowling. 18.The electronic device of claim 17, wherein the conductive cowlingcomprises a metal foil.
 19. The electronic device of claim 15, furthercomprising: a microphone module coupled to the frame member; and a flashmodule coupled to the frame member.
 20. The electronic device of claim15, wherein: the frame member is welded to the housing member; and theframe member defines a network of ribs configured to transfer impactforce from a first portion of the housing member to a second portion ofthe housing member.